Noctua NH-U9B CPU Cooler

Three months after the introduction of the NH-U12P, which has already received more than 30 awards and recommendations from leading international websites and magazines, Noctua released today the newest version of its more compact NH-U9 series: The new NH-U9B uses the recently announced NF-B9 92mm fan and, just like its big brother NH-U12P, will be shipped with Noctua's much acclaimed NT-H1 thermal compound.

"The new NF-B9 fan enables us to replace now the popular NH-U9F with a new, even further improved model", explains Mag. Roland Mossig, Noctua CEO. "The NH-U9B is a worthy little brother for the highly acclaimed NH-U12P: Perfect for those looking for a compact, powerful and quiet premium quality cooler."

Due to its more compact size, the NH-U9B is ideal for HTPCs and small cases as well as all other applications that don't provide sufficient space for its bigger brother NH-U12P.

The NH-U9B is fitted with Noctua's new NF-B9 premium fan that boasts exceptionally high airflow and pressure performance at extremely low noise levels. Bevelled blade tips, Vortex-Control Notches as well as Noctua's SCD drive system and premium-grade SSO-Bearing guarantee outstanding quietness and long-term stability. Just like the NH-U12P, the NH-U9B comes with a nickel-plated finish and Noctua's NT-H1 high-end thermal compound, making it a total quality package for the highest demands!

Price and availability
The NH-U9B is available immediately at a recommended price of EUR 46.90 / USD 54.90.

ASRock X58 SuperComputer Motherboard

Pictures of ASRock's very own X58 motherboard, named simply "X58 Super Computer", appeard today over the web. Now one thing is for sure, it's not really a "super" motherboard and it's not really here to compete with high-end offering, but to appeal to the rest of the audience. After all this is an ASRock, meaning that it will do the work and still offer a good mainstream value with lower price. The motherboard is socket LGA 1366 ready, offering four PCI express x16 slots, three PCI slots and six DDR-3 DIMMs for triple-channel memory kits. The X58 Super Computer comes with completely passive cooling, there are radiators on the north bridge and the board's power elements which are connected by a single heatpipe, while the south bridge is cooled by a modest passive cooler. ASRock's creation also comes with six SATA ports, 12x USB 2.0 ports, one eSATA connector, integrated 7.1 channel audio, dual Gigabit Ethernet and one FireWire connector. This motherboard also implements ASRock's Instant Boot technology, that allows Windows XP or Windows Vista to boot up for 3 to 4 seconds. The AsRock X58 Super Computer has yet to reach stores and receive a price. 

Invisible Speakers Coming Soon to a Television Near You

Emo Labs is a small development firm that had a minor presence at CES this year. While they didn’t have anything major to display, they did have a preview of a new technology that may end up becoming a major technological advancement.

The company showed up their Edge Motion technology, a system that essentially creates an invisible speaker by using “arrays of motors to wiggle the edges of a clear membrane.” If development on this technology pans out, it may be getting integrated into TVs and computers by the end of the year.

The MSI GX630 Makes Notebook Gaming More Affordable

MSI has been a popular manufacturer of notebook PCs and has found a niche market with its MSI Wind line, but the company has made another bound with the debut of the GX630, a gaming notebook with a price tag under a grand.

Gaming PCs (both desktop and notebook alike) are infamous for having high class features and a steep price tag. The GX630, however, offers up a decent selection of features for the gamer at an affordable $800.

Obviously the GX630 won’t stand up to the elitest Alienware systems, but it can definitely hold its own. It comes with a 15-inch screen, 2.3GHz AMD X2 and 4GB of RAM.

LiquidTV Brings Your TV and PC Together

Besides the advent of HDTV, the biggest technological addition to the realm of television has been the DVR, or Digital Video Recorder. DVR technology allows you to pause, rewind, and record live TV for later playback. It gives you the functionality of a VCR without the extra equipment and hassle.

The most popular brand in the DVR market is no doubt TiVo. Not only were they one of the first ones to take advantage of the technology, but the TiVo name has become synonymous with DVR in general. Well, the next evolution of TiVo and DVR technology has come and it is the Nero LiquidTV.

The LiquidTV system essentially turns your PC into a DVR unit by adding a USB TV tuner as well as the TiVo software that comes prepackaged on your set-top box. The system also comes with a remote control and infrared receiver so that you can watch your TiVo/PC from the comfort of your couch.

The LiquidTV has several quirks that make it unsuitable for home DVR replacement, so for now it is just a prototype of a technology that can later be developed to further integrate television and PC use.

The Latest Technology of Sharp Aquos AN-AR300 Rack Theater With Great Features

This is the world of technology there are several things are now available in latest technology. Here we are talk about Sharp Aquos AN-AR300 Rack Theater for your enjoyment this is one of the latest technology of Rack Theater with including great features this latest technology of Sharp Aquos has including 32 “ LCD TV’s it is comes on television rack it comes with makes loudspeaker and 2.1 channel orator system absolute with a sub-woofer.

The entity is 911mm broad and has two deck stations for a BD and DVD recorder. The digital loudspeaker and the sub-woofer carry a productivity of 25W×2ch and 70W respectively .This latest Sharp Aquos AN-AR300 Rack Theater is made in Japan it has MP3 players and cell phones can be linked to the entity using the hi-fi tiny niche.

The latest Sharp Aquos is measure by 911×428×470mm it weight is 40. 5 kg the price of this Sharp Aquos in Japan for 85,000 yen ($850) .

MWC 2009: Video hands on of Toshiba TG01

You may already have seen the gallery we put up last week of the TG01, Toshiba’s iPhone killer in which they were so excitied to unveil that they couldn’t wait til the Mobile World Congress. I know you may have already seen a previous hands on video but this one to follow after the jump shows more clearly how the device will work and of course all the fuzz about those strips!

The 9.9-mm thin handset will feature a 4.1-inch WVGA (800 x 480 pixel) touchscreen display, HSDPA data, GPS, WiFi, a microSD slot, and custom Toshsiba 3D GUI hiding the Windows Mobile 6.1 within. Most notable is that 1GHz Snapdragon chip that Toshiba claims makes the TG01 considerably faster than any device currently on the market with the promise to “revolutionize the mobile entertainment world.”

Universal Charger For Mobile Phones: Coming Soon

You will be able to charge any new mobile phone from the same universal charger beginning on 1 January 2012.

We all need to buy a charger with every new mobile phone. What if it is possible to charge a phone from any available charger? This would not only make life easier for mobile phone consumers, but would be good for the environment too. The GSMA and 17 leading mobile operators and manufacturers said at the Mobile World Congress that they are committed to implementing a cross-industry standard for a universal charger for new mobile phones. The aim of the initiative, led by the GSMA, is to ensure that the mobile industry adopts a common format for mobile phone charger connections and energy-efficient chargers resulting in an estimated 50 per cent reduction in standby energy consumption; old chargers currently generate more than 51,000 tons of waste a year.

he initial group of companies who have joined the GSMA's UCS initiative include 3 Group, AT&T, KTF, LG, mobilkom austria, Motorola, Nokia, Orange, Qualcomm, Samsung, Sony Ericsson, Telecom Italia, Telefónica, Telenor, Telstra, T-Mobile and Vodafone – some of the world's largest mobile operators and manufacturers who together are committed to making a universal charging solution a reality up to 2012 and beyond.

The group has set an ambitious target that by 2012 a universal charging solution (UCS) will be widely available in the market worldwide and will use Micro-USB as the common universal charging interface. The group agreed that by 1 January 2012, the majority of all new mobile phone models available will support a universal charging connector and the majority of chargers shipped will meet the high efficiency targets set out by the OMTP (Open Mobile Terminal Platform), the industry body who developed the technical requirements behind UCS.

"The mobile industry has a pivotal role to play in tackling environmental issues, and this programme is an important step that could lead to huge savings in resources, not to mention convenience for consumers," said Rob Conway, CEO and member of the board, GSMA. "There is enormous potential in mobile to help people live and work in an eco-friendly way and with the backing of some or the biggest names in the industry, this initiative will lead the way."

A universal charger will also make life much simpler for the consumer, who will be able to use the same charger for future handsets, as well as being able to charge their mobile phone anywhere from any available charger. UCS chargers will also include a 4-star or higher efficiency rating, which is up to three times more energy-efficient than an unrated charger.

Furthermore, with potentially 50 per cent less chargers being manufactured each year, the industry can expect to reduce greenhouse gases in manufacturing and transporting replacement chargers by 13.6 to 21.8 million tonnes a year.

"3 welcomes this initiative to reduce the environmental impact of the mobile industry. By working together, the mobile industry can make a significant difference to the number of chargers produced, shipped and lying around our homes and offices along with the amount of energy consumed whilst charging. It can only make the whole process of charging up a mobile much more consumer friendly and 3 will work with our handset partners to target 75 per cent of our handset range to be UCS compliant by the end of 2012," said Nigel Field, general manager, devices and applications, 3 Group.

"This initiative is in line with our overall environmental programme as the universal chargers will be highly energy efficient and will therefore reduce the carbon waste. We estimate that by 2012, the majority of new mobile phones will be universal charging solution compliant," said Terry Kramer, group strategy and business improvement director, Vodafone.

CPU INSIDE KEYBOARD (NEW TECHNOLOGY)

WINDOWS 7 BY MICROSOFT

Windows 7 (formerly codenamed Blackcomb and Vienna) is the next release of Microsoft Windows, an operating system produced byMicrosoft for use on personal computers, including home and business desktops, laptops, Tablet PCs, and media center PCs.

Microsoft stated in 2007 that it is planning Windows 7 development for a three-year time frame starting after the release of its predecessor,Windows Vista, but that the final release date will be determined by product quality.

Unlike its predecessor, Windows 7 is intended to be an incremental upgrade with the goal of being fully compatible with existing device drivers, applications, and hardware. Presentations given by the company in 2008 have focused on multi-touch support, a redesigned Windows Shell with a new taskbar, a home networking system called HomeGroup, and performance improvements. Some applications that have been included with prior releases of Microsoft Windows, most notably Windows Mail, Windows Calendar, Windows Movie Maker, and Windows Photo Gallery, are no longer included with the operating system; they are instead offered separately (free of charge) as part of theWindows Live Essentials suite.

Features:-

Windows 7 includes a number of new features, such as advances in touch, speech, and handwriting recognition, support for virtual hard disks, improved performance on multi-core processors improved boot performance, and kernel improvements.

Windows 7 adds support for systems using multiple heterogeneous graphics cards from different vendors, a new version of Windows Media Center, Gadgets being integrated into Windows Explorer, a Gadget for Windows Media Center, the ability to visually pin and unpin items from the Start Menu and Taskbar, improved media features, the XPS Essentials Pack being integrated, Windows PowerShell Integrated Scripting Environment (ISE), and a redesigned Calculator with multiline capabilities including Programmerand Statistics modes along with unit conversion.

Many new items have been added to the Control Panel including: ClearType Text Tuner, Display Color Calibration Wizard, Gadgets, Recovery, Troubleshooting, Workspaces Center, Location and Other Sensors, Credential Manager, Biometric Devices, System Icons, Action Center, and Display.Windows Security Center has been renamed the Windows Action Center (Windows Health Center and Windows Solution Center in earlier builds) which encompasses both security and maintenance of the computer.

The taskbar has seen the biggest visual changes, where the Quick Launch toolbar has been merged with the task buttons to create an enhanced taskbar or what Microsoft internally refers to as the "Superbar". This enhanced taskbar also enables the Jump Lists feature to allow easy access to common tasks. The revamped taskbar also allows the reordering of taskbar buttons.

Screenshots have appeared demonstrating a new feature called 'Peek'. Peek is a quick way of making all visible windows transparent for a quick look at the desktop.A Microsoft spokesman said that "this will be useful for users who want a quick look at the news" in reference to RSS gadgets on the desktop.

For developers, Windows 7 includes a new networking API with support for building SOAP based web services in native code (as opposed to .NET based WCF web services), new features to shorten application install times, reduced UAC prompts, simplified development of installation packages, and improved globalization support through a new Extended Linguistic Services API.

At WinHEC 2008 Microsoft announced that color depths of 30-bit and 48-bit would be supported in Windows 7 along with the wide color gamutscRGB (which for HDMI 1.3 can be converted and output as xvYCC). The video modes supported in Windows 7 are 16-bit sRGB, 24-bit sRGB, 30-bit sRGB, 30-bit with extended color gamut sRGB, and 48-bit scRGB.

Removed features:-

§  In Windows 7, Windows Mail, Windows Calendar, Windows Photo Gallery, Windows Movie Maker, and Windows Contacts are part of Windows Live Essentials.

§  InkBall

§  Windows Meeting Space

§  Windows Sidebar (Gadgets will remain, sitting freely on the Desktop)

Info on the beta of Windows 7 can be found at: http://technet.microsoft.com/en-us/evalcenter/dd353205.aspx

Windows Vista

The current client version of Windows, Windows Vista (codenamed Longhorn) was released on 30 November 2006 to business customers, with consumer versions following on 30 January 2007. Windows Vista intends to have enhanced security by introducing a new restricted user mode called User Account Control, replacing the "administrator-by-default" philosophy of Windows XP. Vista also features new graphics features, the Windows Aero GUI, new applications (such as Windows Calendar, Windows DVD Maker and some new games including Chess, Mahjong, and Purble Place a revised and more secure version of Internet Explorer, a new version of Windows Media Player, and a large number of underlying architectural changes.

Windows Vista ships in several editions:

• Starter (only available in developing countries)
• Home Basic
• Home Premium
• Business
• Enterprise (only available to large businesses and enterprises)
• Ultimate (combines both Home Premium and Enterprise)

All editions (except Starter edition) are available in both 32-bit and 64-bit versions. The biggest advantage of the 64-bit version is breaking the 4 gigabyte memory barrier, which 32-bit computers cannot fully access. In the first year after Vista's release, most installations were still 32-bit, due to poor driver support of the 64-bit version.

GATE 2009 Answers Solutions Keys in all dicsipline

The GATE 2009 exam was held on Feb 8, 2009. The answer keys of solution of GATE 2009 are given below.

1. Gate 2009 solution Aerospace Engg.
2. Gate 2009 solution Aeronautical Engg.
3. Gate 2009 solution Agricultural Engg.
4. Gate 2009 solution Applied Mechanics,
5. Gate 2009 solution Architecture,
6. Gate 2009 solution Automobile Engg.,
7. Gate 2009 solution Biochemical Engg.,
8. Gate 2009 solution Biomedical Engg., g
9. Gate 2009 solution Biotechnology,
10. Gate 2009 solution Ceramic & Glass Technology,
11. Gate 2009 solution Chemical Engg.,
12. Gate 2009 solution Chemical Technology
13. Gate 2009 solution Civil/Civil & Environmental/Structural Engg.
14. Gate 2009 solution Computer Science & Engg./Technology
15. Gate 2009 solution Control and Instrumentation
16. Gate 2009 solution Electrical Engg.
17. Gate 2009 solution Electro-Chemical Engg.
18. Gate 2009 solution Electronics & Comm./Electronics Engg./Comm. Engg./Telecommunication Engg.
19. Gate 2009 solution Energy Engg.
20. Gate 2009 solution Environmental Engg.
21. Gate 2009 solution Food Technology/Food Processing Engg.
22. Gate 2009 solution Industrial Engg.
23. Gate 2009 solution Industrial Management
24. Gate 2009 solution Information Technology
25. Gate 2009 solution Instrumentation/ Electronics/Control
26. Gate 2009 solution Instrumentation & Process Control
27. Gate 2009 solution Manufacturing Engg.
28. Gate 2009 solution Mechanical Engg.
29. Gate 2009 solution Mechatronics
30. Gate 2009 solution Medical Instrumentation
31. Gate 2009 solution Metallurgical Engg.
32. Gate 2009 solution Mineral Engg./Mineral Dressing
33. Gate 2009 solution Mining Engg./Technology, Mining & Machinery
34. Gate 2009 solution Naval Architecture/Marine Engg.
35. Gate 2009 solution Oil Technology
36. Gate 2009 solution Paint Technology
37. Gate 2009 solution Petro-Chemical Engg.
38. Gate 2009 solution Petroleum Engg./Technology
39. Gate 2009 solution Planning
40. Gate 2009 solution Plastic Technology
41. Gate 2009 solution Polymer Technology/Science
42. Gate 2009 solution Production Engg./Production & Management
43. Gate 2009 solution Production & Industrial Engg.
44. Gate 2009 solution Rubber Technology
45. Gate 2009 solution Textile Engineering & Fibre Science
46. Gate 2009 solution Applied Electronics
47. Gate 2009 solution Applied Physics
48. Gate 2009 solution Agricultural Science
49. Gate 2009 solution Biochemistry
50. Gate 2009 solution Bio-Sciences
51. Gate 2009 solution Computer Applications
52. Gate 2009 solution Chemistry
53. Gate 2009 solution Industrial Chemistry
54. Gate 2009 solution Electronics
55. Gate 2009 solution Engineering Physics
56. Gate 2009 solution Earth Sciences
57. Gate 2009 solution Geology/ Geophysics
58. Gate 2009 solution Life Sciences
59. Gate 2009 solution Life Science/Veterinary/Animal Science
60. Gate 2009 solution Life Sciences (Botany)
61. Gate 2009 solution Life Sciences (Zoology)
62. Gate 2009 solution Materials Science
63. Gate 2009 solution Mathematics/Applied Mathematics
64. Gate 2009 solution Microbiology
65. Gate 2009 solution Nuclear Physics
66. Gate 2009 solution perations Research
67. Gate 2009 solution Physics
68. Gate 2009 solution Pharmaceutical Sciences/Pharmacy
69. Gate 2009 solution Radio Physics
70. Gate 2009 solution Radio Physics & Electronics
71. Gate 2009 solution Statistics
72. Gate 2009 solution Textile Chemistry
73. Gate 2009 solution All other disciplines in Science

Coming Soon

Intel Core i7 Processor

   

• 
  

• Bloomfield - 45 nm process technology
• 256 KB L2 cache
• 8 MB L3 cache
• front side bus replaced with QuickPath up to 6.4GT/s
• Hyper-Threading added, was removed with the introduction of Core
• introduced November 17, 2008
• Variants
• 920 - 2.66 GHz
• 940 - 2.93 GHz
• 965 (extreme edition) - 3.20 GHz

Features:-

The Nehalem architecture has many new features, some of which are present in the Core i7. The ones that represent significant changes from the Core 2 include:

• The new LGA 1366 socket is incompatible with earlier processors.
• On-die memory controller: the memory is directly connected to the processor.
• Three channel memory: each channel can support one or two DDR3 DIMMs. Motherboards for Core i7 have four (3+1) or six DIMM slots instead of two or four, and DIMMs should be installed in sets of three, not two.
• Support for DDR3 only.
• No ECC support.
• The front side bus is replaced by QuickPath interface. Motherboards must use a chipset that supports QuickPath.
• The following caches:
• 32 KB L1 instruction and 32 KB L1 data cache per core
• 256 KB L2 cache (combined instruction and data) per core
• 8 MB L3 (combined instruction and data) "inclusive", shared by all cores
• Single-die device: all four cores, the memory controller, and all cache are on a single die.
• "Turbo Boost" technology allows all active cores to intelligently clock themselves up in steps of 133 MHz over the design clock rate as long as the CPU's predetermined thermal and electrical requirements are still met.
• Re-implemented Hyper-threading. Each of the four cores can process up to two threads simultaneously, so the processor appears to the OS as eight CPUs. This feature was present in the older NetBurst architecture but was dropped in Core.
• Only one QuickPath interface: not intended for multi-processor motherboards.
• 45nm process technology.
• 781M transistors for the quad core version.
• Sophisticated power management can place an unused core in a zero-power mode.
• Support for SSE4.2 & SSE4.1 instruction sets.

Processor cores:-

• The clock rates listed here are as specified by Intel for normal mode. "Turbo boost" can increase the rate on active cores in steps of 133 MHz (Or in steps of the FSB used if overclocked) up to a predetermined limit for short periods when required, which can be useful with single threaded applications.
• The 965 XE has separate unlocked multipliers for memory and cores.
• Core clock above those in the table are not guaranteed by Intel. Rates above 5GHz have been reported.
• Memory rates above those in the table are not guaranteed by Intel. Rates above DDR3-2000 have been reported.
• The processor has a Thermal Design Power of 130W and will slow itself down if this power is exceeded. This feature can be disabled from an option in most of the new motherboards' BIOS. Prices are per unit in lots of 1,000 in USD.

Intel Atom Processor

Intel Atom is the brand name for a line of x86 and x86-64 CPUs (or microprocessors) from Intel, previously code-named Silverthorne and Diamondville processors, designed for a 45 nm CMOS process and intended for use in ultra-mobile PCs, smart phone and other portable and low-power applications.

Produced	2008
Common manufacturer(s)	Intel
Max CPU clock	800 MHz to 1.866 GHz
FSB speeds	400 MT/s to 533 MT/s
Min feature size	0.045 µm
Instruction set	x86, x86-64
Cores	1, 2
Package(s)	441-ball µFCBGA
Core name(s)	Silverthorne Diamondville

Architecture:-

Intel Atom can execute up to two instructions per cycle (similar to the 1993 Pentium). Atom implements the x86 (IA-32) instruction set; x86-64is so far only activated for the Atom 230 and 330 desktop models. N and Z series Atom models cannot run x86-64 code. Like many other designs it divides certain x86-instructions into simpler internal operations prior to execution, but to a significantly lesser extent (only ~4%) than in the Intel P6 (microarchitecture) and NetBurst families. In the Atom, internal μ-ops can contain both a memory load and a memory store in connection with an ALU operation, thus being more similar to the x86 level and more powerful than the μ-ops used in previous designs.This enables relatively good performance with only two integer ALUs, and without any instruction reordering, speculative execution, or register renaming. Atom therefore represents a partial revival of the principles used in earlier Intel designs such as Intel P5 and the i486, with the sole purpose of enhancing the performance per watt ratio.

It has been speculated that the die space used to perform x86-decoding will put the Atom design at a disadvantage compared to other mobile architectures, such as the ARM architecture.The Moorestown platform which is the successor of the Menlow Platform will be a system-on-a-chip design that uses half the power of a Silverthorne processor. The reduced power consumption will make the platform more desirable for use in smartphones and other mobile internet devices.

 

Power requirements:-

While the Atom processor itself is relatively power efficient for an x86 instruction set chip, the chipsets used with it are currently not as power efficient. For example while the N270 chip itself commonly used in netbooks has a maximum TDP of 2.5 W, the Intel Atom platform with the 945GSE Express chipset has a specified maximum TDP of 11.8 W, with the processor only making up a relatively small portion of the total power. Individual figures are 2.5W for the N270 processor, 6W for the 945GSE chipset and 3.3W for the 82801GBM I/O controller. Intel also provides the Intel System Controller Hub US15W chipset with a TDP of less than 5W for the Atom processor Z5xx (Silverthorne) series to be used in ultra-mobile PCs/Mobile Internet Devices (MIDs).

Future:-

The next generation of the Atom, "Lincroft," architecture will be launched in the second half of 2009 and is code-named Pineview. It will be used in Netbook/Nettop systems, and feature a system-on-chip (SOC) with an integrated single-channel DDR2 memory controller and an integratedgraphics core. Pineview, like Diamondville, will be available in single and dual-core versions. It will feature HyperThreading, and is to be manufactured on a 45nm or 32 nm process.

Intel CEO Paul Otellini has stated that, along with other improvements, Atom (specifically Silverthorne) will shrink to the 32 nm process in 2009. It has been suggested that the Atom will be the first Intel chip to transition to 32 nm due to its small size and low complexity.